As Honor's flagship foldable device launched last year, the Magic Vs2 has garnered significant popularity among consumers thanks to its exceptional performance and affordable market positioning. Following the official announcement that the successor, Magic Vs3, will be unveiled at the Magic flagship product launch event on July 12, this new model has now officially gone on sale, and its design has been unveiled.

In terms of design, the Magic Vs3 continues the similar aesthetic of the Magic V2 but with a distinct approach. In terms of other specifications, the Magic Vs3 will largely inherit the specifications of the Magic V2. For instance, it retains the ultra-thin body design (with a thickness of 9.9mm) and is equipped with Qinghai Lake Dual-Battery Technology, offering powerful battery life while maintaining a slim profile.

In addition to the third-generation Qinghai Lake Battery, Honor has introduced their latest Honor Lu Ban Architecture, aimed at addressing the challenge of balancing thinness and high reliability in foldable phones.

According to Honor, the Honor Lu Ban Architecture draws inspiration from the Zhaozhou Bridge structure for the hinge, creating an arched swing arm. Compared to traditional swing arm structures, it adds a main swing arm, enhancing hinge life by 25%, making it the industry's strongest swing arm structure with a 1250% increase in hinge stiffness.

Regarding hinge materials, the second-generation Honor Shield Tunnel Steel pushes the limits of MIM steel, creating the most reliable hinge components with a 16.7% increase in MIM steel strength.

For body materials, Honor adopts aerospace-grade special fiber materials with a strength of up to 5800MPa and a density of only 1.56g/cm³.

Furthermore, Honor introduces Rhino Glass, leveraging second-generation nano-crystalline glass technology with up to 4000+ layers and nano-scale plating processes, achieving 10 times the wear and drop resistance, eliminating the need for screen protectors.

The innovative Lu Ban Architecture delivers the ultimate balance of thinness and reliability, while the third-generation Qinghai Lake Battery further combines thinness with long battery life.

We know that Honor's previous two generations of Qinghai Lake Batteries have showcased the potential for battery technology evolution. Through collaboration with the battery industry chain, Honor has innovated from pre-research technology to feasibility verification, ultimately achieving the industry's first silicon-carbon anode battery technology. This allows for a higher battery capacity in the same volume, astonishing the entire industry. In the latest third-generation Qinghai Lake Battery, silicon content breaks the 10% barrier for the first time in the industry, with the highest battery-to-phone volume ratio of 24.7%.

Simultaneously, coupled with Honor's self-developed energy efficiency enhancement chip, HONOR E1, and the Honor Dujiangyan Power Management System tuning solution, both maximize energy efficiency management precision to meet ultra-long battery life demands across multiple scenarios in complex environments.

Moreover, the phone boasts a 6.43-inch external screen and a 7.92-inch internal screen, supporting zero-risk high-frequency PWM dimming and other features. Notably, the official render reveals an upgraded rear camera module on the Magic Vs3, featuring a periscope lens for enhanced imaging capabilities.

Worth mentioning, following its listing on e-commerce platforms and the unveiling of its design yesterday, the Honor Magic Vs3 foldable phone appeared in the Geekbench benchmark database today, confirming its integration of the Qualcomm Snapdragon 8 Gen 2 processor.

The Honor Magic Vs3 foldable phone, model number FLC-AN00, achieved a single-core score of 2051 and a multi-core score of 5643 on Geekbench 6.3.0.

Additionally, the current product detail page indicates that the Magic Vs3 will offer 256GB, 512GB, and 1TB storage versions. Combined with the exposed design information, it is highly likely that it will continue the tradition of thinness and high cost-performance. However, specific product details of this new foldable device will require further confirmation from Honor. Interested parties may wish to stay tuned.

Incidentally, we note that there is currently limited information available on the specifications of the Honor Magic Vs3 foldable phone.

For reference, Honor's other foldable new product, the Magic V3, is expected to be equipped with the Qualcomm Snapdragon 8 Gen 3 processor, support 5.5G and satellite calls, and feature a rear triple-camera setup with a 50MP main sensor and a periscope lens. Furthermore, the Magic V3 will also debut the industry's first 10% silicon content battery.

Finally, the Magic Vs3 is anticipated to focus on affordability, with rumors suggesting a starting price of 6999 yuan, a significant reduction compared to previous models, potentially attracting many new users to foldable phones.