According to Fast Technology on October 28, the first delid photos of AMD's upcoming Ryzen 7 9800X3D processor have been exposed, revealing some details about the next-generation 3D V-Cache technology.

From the exposed photos, it can be seen that there is no outline of 3D V-Cache on the top of the CCD of the Ryzen 7 9800X3D, which is different from previous Ryzen 5000X3D and Ryzen 7000X3D series.

This confirms that the new generation of 3D V-Cache stacking technology will place the cache below the CCD, which is expected to improve the thermal dissipation capacity of the CCD, enabling higher frequencies and potential overclocking capabilities.

In addition to potentially providing better thermal performance, this layout may also allow for the stacking of two 3D V-Caches on a Zen 5 CCD, realizing a true stacked chip design.

It is reported that the Ryzen 7 9800X3D will feature an 8-core, 16-thread design with 96MB of L3 cache (including 32MB of traditional L3 cache and 64MB of 3D V-Cache), a base clock speed of 4.7GHz, a boost clock speed of up to 5.2GHz, and a TDP of 120W.

Furthermore, the first benchmark scores for the Ryzen 7 9800X3D have emerged, achieving a PugetBench DaVinci score of 10487 and a Premiere score of 14201 when paired with an ROG CROSSHAIR X870E HERO motherboard, 32GB DDR5-6000 memory, and an RTX 4090 graphics card.