Fast Technology News, November 30: According to reports, Apple plans to mass-produce the M5 chip by the end of 2025, and TSMC has already secured an order from Apple.

It is reported that Apple's M5 chip is based on TSMC's advanced 3nm process. Apple is not rushing to adopt the 2nm process, mainly due to cost considerations.

Reports indicate that the Apple M5 will be the first to adopt TSMC's latest SoIC packaging technology. It is understood that SoIC stands for System-on-Integrated-Chip in Chinese.

As part of TSMC's advanced packaging technology suite, 3D Fabric, TSMC's SoIC is the industry's first high-density 3D chiplet stacking technology. The SoIC design creates a bonding interface that allows chips to be directly stacked on top of each other.

Notably, TSMC's SoIC started small-scale trial production in July this year, with a monthly production capacity of 1,900 units expected by the end of this year. Next year, the capacity is expected to exceed 3,000 units, an increase of nearly 60%. By 2027, the monthly production capacity will be approximately 3.7 times that of the end of this year, with a compound annual growth rate of nearly 40%.

The first batch of Apple devices equipped with the M5 chip is under intense preparation, including the iPad Pro, MacBook Pro, MacBook Air, and the new Vision Pro.

Additionally, Apple plans to deploy the M5 chip in AI servers, thereby enhancing its AI cloud service capabilities.