Agibot and others invest in Feikuo Technology

According to the Tianyancha App, Hangzhou Feikuo Technology Co., Ltd. recently underwent industrial and commercial changes, adding Agibot-affiliated Zhiyuan Innovation (Shanghai) Technology Co., Ltd., Gongqingcheng Muzhi Hechuang Venture Capital Partnership (Limited Partnership), Hangzhou Zemeng Investment Management Partnership (Limited Partnership), and others as shareholders. Simultaneously, the registered capital increased from 1 million RMB to 1.07 million RMB. Founded in October 2024, Hangzhou Feikuo Technology Co., Ltd. is headed by legal representative Li Jie and operates in areas including technical services, technology development, technical consulting, technical exchange, technology transfer, technology promotion, sales of intelligent robots, sales of industrial robots, and R&D of intelligent robots. (36Kr)

'Infinite Power' completes angel round funding of over US$200 million

On June 26, general-purpose embodied AI robotics company 'Infinite Power' announced the completion of an angel round funding exceeding US$200 million. The latest angel round was jointly invested by multiple institutions, including JD-affiliated funds, C Capital, Hony Capital, Shengyu Capital, and Fengyuan Capital, with follow-on investments from existing shareholders Linear Capital, Sequoia China, Huaye Tiancheng, and Yarei Capital. The funds raised will continue to be used for R&D of general-purpose embodied AI brains, technological infrastructure construction, and global scaled delivery. (36Kr)

'Lingxi AI' secures hundreds of millions of yuan in funding

Recently, 'Lingxi AI' announced the completion of a new round of funding amounting to hundreds of millions of yuan. This round was led by China Life Yangtze River Delta Science and Technology Innovation Fund, with continued investments from existing shareholders Puhua Capital and Chengtong Science and Technology Innovation Fund. Blue Lake Capital, Beyondsoft, Pangu Ventures, Zhaohui Capital, Caixin Capital, Daoho Long-term Investment, Yigao Capital, and Mingde Capital, among other market-oriented and industrial capital participants, also joined. The next round of funding is currently in its final stages. Previously, Lingxi AI's entire product line had already achieved commercial orders, with cumulative contract amounts reaching tens of millions of yuan. (36Kr)

Tencent Cloud assists Indonesia's XLSMART in achieving AI full-link cloud transformation

On June 26, Indonesian operator XLSMART announced the completion of a large-scale public cloud transformation. Based on XLSMART's long-term digital strategy, Tencent Cloud, as its core cloud strategic partner, integrated AI into the entire migration process, facilitating a smooth transition completed in 4.5 months. During the migration, the Tencent Cloud team also developed over 20 cloud migration Skills based on the code assistant CodeBuddy and efficiency agent WorkBuddy, covering the complete migration lifecycle from resource discovery to cutover verification. This migration involved 1,200 microservices, 1,100 APIs, and 900 business interfaces, smoothly handling over 15TB of core data assets. (36Kr)

Overseas Highlights

SpaceX plans to launch new Starlink mobile service for US consumers

On June 26, it was reported that SpaceX has informed investors of its plan to launch a new Starlink mobile service for US consumers. SpaceX President and COO Gwynne Shotwell stated to investors during an IPO roadshow that the company is considering launching Starlink retail products. (Jiemian)

IBM unveils the world's first sub-nanometer chip technology

On June 25, IBM announced a revolutionary breakthrough in the semiconductor field, officially launching the world's first 'sub-1nm' chip process technology. This technology adopts IBM's self-developed 'three-dimensional vertical stacking' (NanoStack) transistor architecture, directly advancing to the 0.7-nanometer (7-angstrom) node, marking the official entry of chip manufacturing into the angstrom era. (iJiwei)

ASML collaborates with TNO to enhance Europe's 6-inch wafer-level InP photonic chip manufacturing capabilities

On June 24, TNO (Netherlands Organisation for Applied Scientific Research) and ASML announced a new partnership aimed at strengthening Europe's semiconductor ecosystem through the development and industrialization of photonic chips. The focus of this collaboration is to leverage TNO's new photonic chip pilot line being constructed at the High Tech Campus in Eindhoven, which is also a key hub for European integrated photonics. (iJiwei)