ReiI Tech Passes HKEX Review, Eyes 'First Visual Embodied Intelligence Stock' Title in Hong Kong Market

According to filings with the Hong Kong Stock Exchange (HKEX), ReiI Tech successfully cleared a main board listing review on June 24, with Huatai International, CCB International, and ABC International serving as joint sponsors. Starting with visual perception, ReiI Tech has expanded into embodied robot products, leveraging its proprietary VTFLA technology. The company aspires to become the 'First Visual Embodied Intelligence Stock' in Hong Kong and set a precedent in the 18C (specialized technology) sector. (36Kr)

SK Hynix Mulls Expanding Investment in Cheongju NAND Wafer Plant in South Korea

Reports indicate that SK Hynix is contemplating increasing its investment in its Cheongju NAND wafer plant in South Korea, with related plans anticipated to be unveiled on June 29. (Jiemian)

CICC: Future High-End AI Servers Likely to Adopt Composite Cooling Solution Combining 'Diamond Heat Sinks with Full Liquid Cooling'

A research report by CICC suggests that proximal cooling and liquid cooling form a complementary system. Presently, the power consumption of GPUs in the H100, Blackwell, and Rubin series exceeds the kilowatt threshold. 3D packaging further intensifies local chip heat flux, underscoring the thermal conductivity limitations of copper and aluminum materials. Diamond, boasting an ultra-high thermal conductivity of 2000W/mK and a low thermal expansion coefficient, can swiftly dissipate chip hotspots. In industrial applications, diamond facilitates uniform heat distribution near the chip, while liquid cooling manages system-level heat dissipation at the cabinet level. The two are not mutually exclusive. Future high-end AI servers are projected to adopt a composite cooling solution integrating 'diamond heat sinks with full liquid cooling'. (36Kr)

Yingli Shares: No Orders Secured Yet for Dell AIPC Structural Components

Yingli Shares clarified on an interactive platform that it has not yet secured orders for Dell AIPC structural components. Regarding HP's AIPC structural components, the company has commenced sample submission and certification processes, but orders are still pending finalization. (36Kr)

Overseas Highlights

NVIDIA and Google Unveil AI Liquid Cooling Strategies, A-Share Companies Position Across Entire Industrial Chain

Recently, AI liquid cooling technology pathways have once again sparked industry discussions. Google introduced the Brazos technology pathway, significantly boosting traditional data center performance. NVIDIA unveiled the Rubin full liquid cooling solution in an official blog post. This underscores that heat dissipation is emerging as a pivotal industry concern. Industry experts note that three types of data center cooling technology pathways currently coexist. Given global variations in infrastructure, geography, and climate, future data centers may predominantly rely on liquid cooling while operating in tandem with other approaches. Currently, several domestically listed companies have positioned themselves in the AI liquid cooling sector, encompassing the entire industrial chain, including components like cold plates and CDUs, cooling fluids, and complete machine equipment. (Shanghai Securities News)

Korea Exchange Postpones Launch of Weekly Options for Individual Stocks Including Samsung and SK Hynix

The Korea Exchange announced on Thursday that it has delayed the launch of weekly options for four major stocks, originally scheduled for next Monday (June 29). These stocks are Samsung Electronics, SK Hynix, Hyundai Motor, and LG Energy Solution. (Sina Finance)

Manst: Current Products Do Not Involve HBM Memory Chip Packaging or CPO Optical Module Applications

An investor inquired whether the company's coating technology is applicable to hot sectors in the current AI industrial chain, such as HBM memory chip packaging and CPO optical modules, and whether the company possesses relevant technical reserves or customer connections. On June 25, Manst stated on an interactive platform that its current products do not encompass these applications, and investors should be mindful of investment risks. (36Kr)