According to a report by Kuaikeji on August 18, media reported that TSMC's first European wafer fab will hold a groundbreaking ceremony on August 20, which is expected to set a new record for the speed of investment by major semiconductor companies in Europe in recent years.

The TSMC plant is expected to use TSMC's 28nm and 22nm planar complementary metal-oxide-semiconductor (CMOS) technologies, as well as 16nm and 12nm FinFET process technologies.

According to the plan, the plant's monthly production capacity will reach 40,000 300mm (12-inch) wafers.

In August 2023, TSMC jointly announced with key customers such as Bosch, Infineon, and NXP Semiconductors the establishment of the European Semiconductor Manufacturing Company (ESMC) as a joint venture, with a plant to be established in Germany.

The TSMC plant in Germany will be part of ESMC, with TSMC's partners Infineon, Bosch, and NXP Semiconductors each holding a 10% stake.

The new plant is located near Bosch's Dresden facility and close to Infineon's power semiconductor plant, which is undergoing a 5 billion euro expansion investment.