06/08 2026
517
As 5G commercialization reaches maturity, the global telecommunications industry has officially entered a critical phase of 6G technology pre-research and experimental deployment.
As the next-generation mobile communication technology, 6G leverages core technologies such as terahertz communication, integrated sensing and computing, space-air-ground-sea integration, and AI-native networks to break traditional terrestrial communication boundaries. It establishes a new communication system featuring ubiquitous coverage, high-speed transmission, ultra-low latency, and intelligent perception.
According to China's IMT-2030 (6G) Promotion Group roadmap, 6G technical standards will be finalized by 2028, with small-scale commercialization in 2029 and large-scale deployment beginning in 2030.
The 6G industrial chain exhibits a clear three-tier architecture, comprising upstream basic materials and core components, midstream network infrastructure and ubiquitous communication facilities, and downstream terminal devices and industry-specific applications.
The upstream lays the hardware technological foundation, the midstream builds the ubiquitous communication network backbone, and the downstream realizes industrial value delivery.
The 6G upstream sector serves as the technological foundation of the entire industrial chain, representing the area with the greatest potential for domestic substitution and the highest technical barriers.
Compared to 5G, 6G's technical characteristics of high frequency, high speed, low loss, and high computing power impose new requirements on core hardware such as basic materials, semiconductor chips, RF components, and optoelectronic devices. Traditional communication components are no longer suitable for terahertz and millimeter-wave communication scenarios.
Key upstream segments include five major areas: third-generation semiconductors, high-frequency substrates, photonic chips and devices, high-frequency PCBs and connectors, and RF components.
Third-generation semiconductors are the core support for 6G RF systems. Traditional silicon-based materials are completely replaced in 6G high-frequency communication scenarios, with compound semiconductors such as gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP) becoming essential materials for base station power amplifiers, satellite payloads, and terahertz transceiver equipment.
Key enterprises include San'an Optoelectronics, Tianyue Advanced, Luxshare Precision, China Ceramics Electronics, Chengchang Technology, and Guobo Electronics, covering the entire industrial chain from epitaxial wafers and substrates to RF packaging and phased-array chips.
High-frequency substrates are crucial for ensuring low-loss transmission of 6G high-frequency signals. LCP and PTFE high-frequency copper-clad laminates are widely used in 6G millimeter-wave antennas and high-frequency PCBs.
Companies such as Huazheng New Materials, Preht, Wote Advanced Materials, and Kingfa Science and Technology have achieved research, development, and mass production of LCP resins, films, and modified antenna materials.
Photonic chips and devices form the foundation of 6G all-optical transmission. With the 6G network upgrade, the bearer network will fully transition to 1.6T/3.2T silicon photonics modules, with hollow-core fibers and other ultra-low-loss transmission materials becoming research priorities.
Companies like Zhongji Innolight and Eoptolink have completed Pre-6G trial sample deliveries of high-speed optical modules. Accelink Technology focuses on high-end self-developed photonic chips, while TFC Communication holds a leading global position in passive optical devices.
High-frequency PCBs and high-speed connectors are core connection hardware for base stations and terminal devices.
In the high-frequency microwave board and FC-BGA substrate sectors, domestic companies such as Shennan Circuits, Kingboard Electronics, and Suntak Technology are deeply involved in 6G base station and satellite hardware support.
In the RF connector sector, AVIC Jonhon, Electro-Techno, and Rykon Electronics maintain domestic leadership positions.
Additionally, in the RF components sector, Maxscend, Sunway Communication, and Speed Tech cover core devices such as RF switches, antenna vibrators, and filters.
The midstream sector is the core hub of the 6G industrial chain, integrating upstream components and building space-air-ground-sea integrated ubiquitous communication infrastructure.
This segment primarily includes five core areas: 6G main equipment, optical communication systems, satellite internet, telecommunications operators, and high-end test instruments, representing the key areas for current 6G pre-research and field trials.
6G main equipment is the core of network construction, focusing on integrated sensing and computing base stations, BBU/AAU hardware upgrades, and core network iterations.
Huawei holds a global leading position in 6G patent reserves, having take the lead (been the first to) deployed integrated sensing and communication prototypes and next-generation base station equipment. It is a core supplier for domestic Pre-6G trial networks.
ZTE has over 13,000 6G patents, ranking among the top three globally, with a domestic trial network equipment market share exceeding 60%. It is comprehensively deploying terahertz terrestrial base stations and satellite-ground communication solutions.
CICT Mobile, leveraging the technological heritage of Datang Telecom, is involved in both base station equipment and test equipment, leading the standardization of satellite direct communication and deeply participating in field trials with the three major operators.
Optical communication systems provide the all-optical network foundation for 6G, covering core products such as optical fiber cables, deep-sea submarine cables, and optical transmission equipment.
In the 6G era, ultra-low-loss optical fibers and hollow-core fibers will completely replace traditional optical fibers to meet long-distance, high-speed transmission needs.
Domestic leaders Hengtong Optic-Electric and Zhongtian Technology have achieved technological breakthroughs in hollow-core fibers and mass production of deep-sea 6G submarine cables, while Yangtze Optical Fibre and Cable focuses on high-end optical fiber materials.
Unisplendour Corporation, FiberHome Telecommunications, and Ruijie Networks specialize in optical system equipment research and development, building a complete 6G all-optical bearer network.
Space-air-ground integrated satellite communication is a core landmark technology distinguishing 6G from 5G, achieving global seamless communication coverage through four-dimensional networking of terrestrial cellular networks, low-Earth orbit satellites, high-altitude platforms, and undersea communications. Key application scenarios include satellite direct-to-terminal connectivity and ubiquitous IoT coverage.
The industrial chain is divided into four major sectors: satellite manufacturing, satellite operation, ground gateway stations, and onboard payloads.
China Satellite and Hagrid Communication are responsible for satellite assembly and mass production. China Satcom is the domestic core commercial satellite operator, while Shanghai Hansen and Potevio Technology focus on onboard equipment and ground gateway station system integration.
Telecommunications operators are the core entities driving 6G R&D investment, trial network construction, and standardization, serving as the source of demand for the industrial chain.
China Mobile, China Telecom, and China Unicom are the core drivers of 6G industrial development, with China Mobile leading in domestic R&D investment and dominating the construction of national Pre-6G trial networks.
High-end communication test instruments are essential tools for 6G technology R&D and equipment verification.
Transcom Instruments has become a domestic leader in terahertz and RF test equipment, deeply participating in 6G technical standardization and trial verification work.
The downstream sector represents the value realization phase of 6G technology, primarily covering smart terminals, IoT modules, and industry-specific applications. The industry is expected to explode after the large-scale commercialization of 6G in 2030.
Leveraging 6G's core capabilities of Tbps-level transmission rates, sub-millisecond latency, centimeter-level communication sensing, ubiquitous AI computing power deployment, and space-air-ground-sea integrated connectivity, 6G will comprehensively empower consumer, industrial, transportation, medical, low-altitude, and other industry-wide scenarios.
Terminals and IoT modules serve as the foundational carriers for 6G applications.
Quectel and Fibocom are proactively deploying 6G NTN satellite direct-to-module solutions to meet the needs of ubiquitous IoT terminals.
Consumer electronics companies have joined global 6G industry alliances to develop 6G smartphones and XR holographic terminals.
Hikvision and Dahua Technology focus on industrial sensing terminals, developing 6G machine vision and industrial intelligent monitoring equipment.
In vertical application areas, 6G has formed six core implementation tracks:
At present, domestic companies are primarily engaged in technology pre-research, prototype testing, and small-batch trial supply, with performance realization cycles concentrated after the standard freeze in 2028 and large-scale commercialization in 2030.
Looking ahead, as technological iterations continue and trial networks are fully rolled out, domestic substitution of upstream core components, midstream network infrastructure construction, and downstream scenario implementations will sequentially encounter industrial turning points. 6G is poised to become the core infrastructure for the development of the next-generation digital economy, artificial intelligence, low-altitude economy, and industrial internet.
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