The Weike Cup·OFweek 2026 China Optical Industry Annual Selection is hosted by OFweek, a portal for China's high-tech industry, and co-organized by OFweek Optics. The event collaborates with authoritative associations, research institutes, and core enterprises in the optical field. It continues the professional reputation of the 'OFweek Awards' with over a decade of deep cultivation (deep cultivation) in the high-tech sector. With an open, fair, and rigorous selection process, it has become a highly professional and influential benchmark selection in the optical field.

This selection will focus on core sectors such as optical materials, optical instruments and equipment, vacuum coating, optical components, optoelectronic sensors, optical information storage, and other optical sensing technologies. It aims to recognize breakthrough excellent products, cutting-edge technologies, benchmark cases, and leading enterprises in the industry, encouraging research on core technologies.

Currently, the event is in the midst of a fervent application phase, with industry enterprises responding enthusiastically. Shandong Core Optoelectronics Technology Co., Ltd. is officially entering for the 'Weike Cup·OFweek 2026 Optical Industry Annual Innovation Product Award'.

Entering Enterprise

Entry Information

Award Application:

Weike Cup·OFweek 2026 Optical Industry Annual Innovation Product Award

Name of Entering Product:

Silicon Carbide Laser Lifting-off Equipment 

Product Launch Year/Development Background:

December 2025 / Development Background: With the explosive demand for silicon carbide power devices in fields such as new energy vehicles, 5G communications, and AR glasses, traditional multi-wire sawing technology faces physical limits, including material losses as high as 40% and the inability to process 12-inch and larger-size ingots. Meanwhile, high-end laser lifting-off equipment has long been monopolized by Japan's Disco Corporation, with long delivery cycles, high prices, and technological blockades. To break this 'chokepoint' situation and respond to the national requirement for independent control of high-end equipment such as semiconductor devices, Shandong Core Optoelectronics Technology Co., Ltd. collaborated with Shandong University and Inspur Cloud Industrial Internet Co., Ltd. to successfully launch this product through technological research.

Product Brief Description:

This product is a precision laser processing equipment based on the ultrafast laser modification and lifting-off principle, specifically designed for the lifting-off process from large-size silicon carbide ingots to wafers. The equipment uses ultrafast lasers to induce nonlinear absorption inside the ingot, forming a micro-crack modification layer, and then achieves low-stress separation through ultrasonic assistance. Core modules include: a high-uniformity beam shaping and focal point control system, an XYZ high-precision motion platform (accuracy ±1μm, speed ≤1200mm/s), an automatic loading and unloading unit, and a deep learning-based visual inspection and process self-optimization software. The equipment is compatible with 4-12 inch (expandable to 14 inch) ingots, with an 8-inch single processing time ≤20 minutes, cutting loss ≤80μm, and wafer TTV ≤10μm. The product has passed third-party testing and has been installed and applied in four customer units, with cumulative stable operation exceeding three months and a yield stability above 95%.

Key Innovation Points:

1. Low-loss large-size laser lifting-off technology: Overcame the precise control challenge of nonlinear absorption of ultrafast lasers inside silicon carbide. Through beam shaping and real-time focal point compensation, the cutting loss was reduced from 40% in traditional wire sawing to ≤80μm, and 12-inch ingot compatibility was achieved, expandable to 14 inches, solving the industry bottleneck of inability to cut large sizes.

2. Fully automatic complete machine integration: Designed an automated system with opto-mechatronic coordination, integrating robotic arm automatic loading and unloading, high-precision visual automatic edge/focus alignment, and multi-axis linkage (linked) control, significantly reducing reliance on highly skilled operators.

3. Deep learning-based intelligent process package: Established a process database covering multiple parameters and deployed AI models for real-time edge collapse detection, focal point self-calibration, and parameter self-optimization, solving industrial pain points such as narrow laser processing windows and poor consistency of different batches of ingots, significantly improving mass production yield and stability.

Reasons for Entry:

Its core technical indicators (processing time ≤20min/8-inch, loss ≤80μm, TTV ≤10μm) have reached international advanced levels, with overall technology leading domestically. It has broken the long-term monopoly of Japan's Disco Corporation and achieved localization substitution of high-end semiconductor laser processing equipment. The product has obtained 4 authorized invention patents, 3 utility model patents, and 1 software copyright, and has been verified in practical applications by multiple benchmark customers, demonstrating significant economic and social benefits. The promotion of this equipment can reduce the cost of silicon carbide substrates by more than 20%, strongly supporting the development of downstream industries such as new energy vehicles, smart grids, and AR glasses, and holds significant strategic importance for ensuring the security of China's third-generation semiconductor industry chain.

Welcome to Enter

The annual selection is fervently accepting applications. We welcome pioneering forces from all segments of the optical industry chain to actively participate and compete for industry honors!