Through the use of fluorinated monomers, fluorinated photosensitive polyimide gains the ability for direct photolithographic patterning while further optimizing the material's dielectric, optical, and solubility properties. However, an increase in fluorine content can also reduce the product's adhesive properties and glass transition temperature.

Fluorinated photosensitive polyimide, abbreviated as FPSPI, is a subdivision of photosensitive polyimide (PSPI). It is an advanced polymeric material that incorporates both fluorinated groups and photosensitive functional groups into the polyimide (PI) molecular chain.

According to the "Global and China Fluorinated Photosensitive Polyimide (FPSPI) Industry Research and 15th Five-Year Plan Analysis Report 2026-2030" released by the Xinsijie Industry Research Center, the introduction of low-polarity fluorinated groups endows fluorinated photosensitive polyimide with several unique properties: first, a low dielectric constant that meets the insulation requirements of high-frequency communication chips; second, low absorption in the near-infrared region, excellent light transmittance, low hygroscopicity, and good solubility in organic solvents, meeting the demands of the optical communications field. Through the use of fluorinated monomers, fluorinated photosensitive polyimide gains the ability for direct photolithographic patterning while further optimizing the material's dielectric, optical, and solubility properties. However, an increase in fluorine content can also reduce the product's adhesive properties and glass transition temperature.

Fluorinated photosensitive polyimide can be synthesized using 4,4'-(hexafluoroisopropylidene)phthalic anhydride and 1,5-bis(aminophenyl)-1,4-pentadien-3-one as raw materials. The main differences between fluorinated photosensitive polyimide and fluorinated polyimide (FPI) are as follows: fluorinated polyimide, through fluorination modification, possesses good transparency and low dielectric properties but lacks photosensitivity. Its applications are concentrated in areas such as liquid crystal films, optoelectronic components, and separation membranes. Fluorinated photosensitive polyimide, on the other hand, adds photosensitive patterning functionality to fluorinated polyimide, enabling the formation of micrometer-scale fine patterns through photolithography processes.

The downstream application areas of fluorinated photosensitive polyimide include high-tech industries such as semiconductor packaging, display panels, and optical communications. In the semiconductor field, fluorinated photosensitive polyimide, as an advanced packaging material, can be used in surface protective layers, bump passivation layers, and redistribution layers for wafer-level packaging. It simplifies the multilayer wiring process and achieves low dielectric loss for high-frequency, high-speed signal transmission, making it a key material for 2.5D/3D advanced packaging. In the OLED display field, fluorinated photosensitive polyimide is one of the critical materials in the AMOLED display process, used in three layers: the planarization layer, pixel definition layer, and support layer.

Industry analysts from Xinsijie stated that fluorinated photosensitive polyimide is a high-end subdivision of photosensitive polyimide (PSPI), and its market continues to grow due to the rapid development of advanced packaging and OLED display industries. From 2021 to 2025, the compound annual growth rate of the global photosensitive polyimide (PSPI) photoresist market is 12.5%. China's semiconductor and display panel industries are developing rapidly, accelerating the import substitution of photosensitive polyimide (PSPI) photoresists. Related companies include Beijing Bayi Space Liquid Crystal Technology Co., Ltd. and Hubei Dinglong Holdings Co., Ltd. However, the demand for high-end products still relies heavily on imports. Thus, China's fluorinated photosensitive polyimide industry has significant development potential.

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