Spring 2025 – Advantech, a leading global provider of industrial embedded AI solutions, announces the release of the EPC-R7300 Orin Nano Super AI edge computing system, powered by the NVIDIA Jetson Orin Nano 8GB system module. Leveraging the potent NVIDIA Jetson Orin platform and latest software enhancements, the EPC-R7300 delivers up to 67 TOPS of AI performance while maintaining low power consumption (25W). Its compact design (152x173x50mm) and pre-installed Ubuntu operating system streamline AI deployment, making it an optimal choice for next-generation generative AI applications, including small-scale large language models (LLMs), visual language models (VLMs), and vision transformers (ViTs).

Edge Computing System for Implementing Generative AI at the Edge

Highly Reliable NVIDIA Jetson Orin Nano Super Development Kit

Advantech's industrial-grade AI edge computing system, EPC-R7300, is tailored to meet the diverse computing demands of developers. With NVIDIA JetPack support, there's no need for additional driver installation or configuration, enabling a seamless transition from NVIDIA developer kits to the EPC-R7300 with enabled I/O, thus simplifying the integration process.

For edge AI applications requiring high-resolution image input (e.g., image inference), the EPC-R7300 supports USB and IP camera interfaces, making it ideal for machine vision tasks. It also features an HDMI 2.0 connection for 4K displays and ensures robust data connectivity via two GbE LAN connections.

For extended functionality, the EPC-R7300 offers two USB 3.2 Gen 1 ports and three M.2 slots for wireless modules and storage expansion (one 2230 E-Key for Wi-Fi 6 and Bluetooth, one 3042/52 B-Key for 4G/5G connectivity, and one 2280 M-Key with a pre-installed 128GB NVMe SSD and additional expansion capabilities).

With its robust capabilities and easy integration, the EPC-R7300 provides developers with versatile solutions for edge AI applications.

Rugged Design for Industrial Applications

The EPC-R7300 Orin Nano Super AI edge computing system boasts a durable design that ensures smooth operation in harsh industrial environments. It supports a wide temperature range (-20 to 60ºC) and wide voltage (9 ~ 36 VDC) and offers high vibration resistance (3.0 Grms). This rugged design enables customers to rapidly prototype applications, simplify the development process, and minimize resources and timelines for system integration and validation, accelerating the transition to edge intelligence solutions.

Versatile Rear I/O Configurations to Meet Diverse Application Needs

To cater to the needs of various applications, the EPC-R7300 offers up to five rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIO, USB 2.0, and a 4xGbE hub for system capacity expansion. All I/O drivers are integrated into the NVIDIA JetPack 6.2 Board Support Package (BSP), allowing the EPC-R7300 to deliver exceptional functionality without additional integration efforts.

The EPC-R7300 supporting the NVIDIA Jetson Orin Nano Super will be available in the first quarter of 2025. For inquiries, please contact Advantech's embedded service hotline at 400-001-9088.

EPC-R7300 Highlights: